[micromachines]

Analysis of Signal Transmission Efficiency in Semiconductor Interconnect and Proposal of Enhanced Structures

[IEEE ACCESS]

First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer

[IEEE TCPMT]

Two-Step Ar/N2 Plasma Treatment on SiO2 Surface for Cu/SiO2 Hybrid Bonding

[Scientific Reports]

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

[APPLIED SCIENCES-BASEL]

Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding

[반도체디스플레이기술학회지]

Design of 60-GHz Back-to-back Differential Patch Antenna on Silicon Substrate

[electronics]

Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices

[Microelectronic Engineering]

Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles

[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,]

Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY]

Effect of the Annealing Process on Cu Bonding Quality Using Ag Nanolayer

[Journal of Electrical Engineering & Technology]

Compact, Flexible and Transparent Antenna Using MMF for Conformal Wi?Fi 7 Applications

[Electronic Materials Letters]

Copper Bonding Technology in Heterogeneous Integration

[APPLIED SCIENCES-BASEL]

A Review of Cell Operation Algorithm for 3D NAND Flash Memory

[JOURNAL OF ELECTRONIC MATERIALS]

Low-Temperature Diffusion Behavior of Ti in Cu/Ti-Ti/Cu Bonding

[APPLIED SURFACE SCIENCE]

Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material

[APPLIED SCIENCES-BASEL]

The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air

[마이크로전자 및 패키징학회지]

저온 Cu-Cu본딩을 위한 12nm 티타늄 박막 특성 분석

[마이크로전자 및 패키징학회지]

Ar/N2 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석

[마이크로전자 및 패키징학회지]

저온 Cu/Ag-Ag/Cu 본딩에서의 Ag 나노막 효과

[ELECTRONIC MATERIALS LETTERS]

Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects

[IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY,]

Low-Temperature (260 ?C) Solderless Cu?Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration

[IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY]

Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding

[Scientific Reports]

Anti?oxidant copper layer by remote mode N2 plasma for low temperature copper?copper bonding